The Open Compute Project (OCP) and major silicon vendors (NVIDIA, AMD, Intel) collaborated on a white paper proposing a 30°C minimum coolant temperature standard for AI/ML hardware cooling. This stand…
Vertiv’s research debunks the myth that higher chip temperatures universally enable compressor-less cooling, emphasizing geography, ambient conditions, and water availability as critical factors. The …
Vertiv published a guide on designing liquid cooling infrastructure for scalability, emphasizing oversized headers, modular components, and phased expansion to avoid costly retrofits. The article high…
Compass Datacenters and Vertiv deployed Vertiv SmartRun, an overhead prefabricated infrastructure system, to streamline data hall deployment for AI workloads. The standardized, factory-assembled syste…
Vertiv and NVIDIA are collaborating to enable gigawatt-scale AI factories, where power, cooling, and compute are co-designed as a single system. Digital twin technology and prefabricated modules aim t…
Vertiv announced rapidly deployed, system-level reference architectures for NVIDIA Omniverse DSX Blueprint to support AI factories as engineered systems rather than component assemblies. The updates i…
Vertiv emphasizes its ability to support AI infrastructure with end-to-end systems handling power, cooling, IT, and services, scaling from 6 to 150 kW per rack. Their Vertiv™ OneCore platform is posit…
Vertiv introduced the PowerUPS 100 Standby Series, a new line of compact UPS systems designed to maintain continuity for personal computing, gaming, and networking devices. The product targets users r…
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