
A roadmap for the future chip coolant temperature
The Open Compute Project (OCP) and major silicon vendors (NVIDIA, AMD, Intel) collaborated on a white paper proposing a 30°C minimum coolant temperature standar...
3 content pieces·2 feature updates·2 technical updates·1 product launches·1 executive changes·1 CONTENT MARKETING·1 case studies
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The Open Compute Project (OCP) and major silicon vendors (NVIDIA, AMD, Intel) collaborated on a white paper proposing a 30°C minimum coolant temperature standar...

Vertiv’s research debunks the myth that higher chip temperatures universally enable compressor-less cooling, emphasizing geography, ambient conditions, and wate...
Vertiv published a guide on designing liquid cooling infrastructure for scalability, emphasizing oversized headers, modular components, and phased expansion to ...
Compass Datacenters and Vertiv deployed Vertiv SmartRun, an overhead prefabricated infrastructure system, to streamline data hall deployment for AI workloads. T...

Vertiv and NVIDIA are collaborating to enable gigawatt-scale AI factories, where power, cooling, and compute are co-designed as a single system. Digital twin te...
Vertiv introduced EnergyCore Lithium battery cabinets featuring integrated battery management, real-time SOC/SOH monitoring, and compatibility with AI-driven po...

Vertiv announced rapidly deployed, system-level reference architectures for NVIDIA Omniverse DSX Blueprint to support AI factories as engineered systems rather ...
Vertiv emphasizes its ability to support AI infrastructure with end-to-end systems handling power, cooling, IT, and services, scaling from 6 to 150 kW per rack....
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